MECOSTRIP CPL AGCU Process Documentation (English Version)
This is an electrolytic stripping agent developed for stainless steel belts used in continuous plating devices and hoop plating devices to strip silver and copper.
This is a plating chemical for semiconductor back-end processes, selective silver plating for semiconductors, and connector plating-related applications, boasting nearly 40 years of achievements in Japan. It has particularly strong results with major Japanese companies. This is an electrolytic stripping agent developed to remove silver and copper from stainless steel belts used in continuous plating systems and hoop plating systems. For more details, please download the PDF (technical documentation in English).
- Company：河口・サポート 名古屋事務所
- Price：Other
